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FLY905-JM18-T6 Solder Paste
After years of close cooperation with famous LED manufacturers, and 2 years of research and development with renowned institutes, Yik Shing Tat Industrial Co. Ltd. now presents you FLY905-JM18-T6. This solder paste was tailor-made for LED die bonding with good heat conductivity, reactivity and strength, and low residues.
Die bonding is an essential process in LED packing. The heat conductivity of the material will highly affect the LED's heat dissipation. FLY905-JM18-T6 has a heat conductivity twice than that of silver paste. Also the alloy composition is Sn-3.0Ag-0.5Cu, very cost effective.

Type Alloy Composition Powder Size Melting Point Density Lead Halogen
FLY905-JM18-T6 Sn-3.0Ag-0.5Cu Type 6 217~221 7.4±0.05 g/cm3 Lead-free Halogen-free